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Electronisc World Hot News
Indian chip agency, SEMI join forces
The India Semiconductor Associ 5b4 ation has agreed to work with the U.S.-based Semiconductor Equipment and Materials International to promote a chip and solar manufacturing in India. Details... more »
 
TES expands Indian multimedia design group
Electronics design and m 5b4 anufacturing services group TES (Langon, France) is planning to grow its embedded hardware, software and system design team in India from currently 50 engineers to over 100 in over the next six months. Details... more »
 
Surface - mount package shrinks power MOSFETs by 20%
Toshiba America Electronic Components Inc. (TAEC) announced the availability of its second-generation Smart Thin Package (STP2) surface-mount packaging for power MOSFETs that is 20 percent smaller than the original STP package. Details... more »
 
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