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Solder made obsolete by growing copper pillars
Soldering chips to boards may become a thing of the past as a result of research on copper materials sponsored by Semiconductor Research Corp. at the Georgia Institute of Technology. Details... more »
Soldering chips to boards may become a thing of the past as a result of research on copper materials sponsored by Semiconductor Research Corp. at the Georgia Institute of Technology. Details... more »
ST readies integrated SoC for NFC applications
STMicroelectronics 5b4 will start sampling in the second quarter of the year to lead customers engineering versions of an integrated secure SoC for Near Field Communications applications. Details... more »
STMicroelectronics 5b4 will start sampling in the second quarter of the year to lead customers engineering versions of an integrated secure SoC for Near Field Communications applications. Details... more »
Breakthrough NXP solution brings H.264/MPEG 4 to iDTV
NXP Semiconductors claims first single-chip LCD TV solution to deliver ground-breaking HDTV picture quality for advanced H.264 broadcast and MPEG-4 Internet content. Details... more »
NXP Semiconductors claims first single-chip LCD TV solution to deliver ground-breaking HDTV picture quality for advanced H.264 broadcast and MPEG-4 Internet content. Details... more »