rc2004_12.djvu Journals Remont_and_service 2004 - Service manuals, schematics, documentation, programs, datasheets, electronics

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FETs housed in ultra - small packaging for wireless applications
By leveraging its new chip scale packaging technology, Avago has been able to reduce the size of its field effect transi 5b4 stors to occupy less than 5% the volume of a standard SOT-343 package. Details... more »

 

Capacitive touch sensing tool eases interface
Cypress Semiconductor Corp. has developed the CapSense Express capacitive touch sensing solution for fast and easy button and slider replacement. Details... more »

 

.65mm LGA socket runs up to 60GHz
Ironwood Electronics has released the XG-LGA-7000 LGA socket for 0.65mm pitch LGA devices designed for a 12mm package size, and operates up to 40GHz with less than 1dB of insertion loss. Details... more »