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Wind tunnel allows thermal testing on PCBs, cooling devices
Advanced Thermal Solutions, Inc. (ATS) has introduced the BWT-104, a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices including heat sinks, heat exchangers and cold plates. Details... more »
Advanced Thermal Solutions, Inc. (ATS) has introduced the BWT-104, a research quality, open loop, benchtop wind tunnel for thermal characterization of components, circuit boards and cooling devices including heat sinks, heat exchangers and cold plates. Details... more »
Telephone interface module half the size of previous generation products
Xecom, Inc. developed the XE0402LCC, a telephone data access arrangement (DAA) interface module that is half the size of the previous generation product. The XE0402LCC includes a solid-state hook-switch, caller ID pass through, and ring detector while providing a 3000 VAC isolation barrier. Details... more »
Xecom, Inc. developed the XE0402LCC, a telephone data access arrangement (DAA) interface module that is half the size of the previous generation product. The XE0402LCC includes a solid-state hook-switch, caller ID pass through, and ring detector while providing a 3000 VAC isolation barrier. Details... more »
AMC designed for content-aware networking applications requiring deep packet inspection
Raza Microelectronics, Inc. (RMI) released the MC4100 series of advanced mezzanine cards (AMC) suited for Gigabit line-rate, content-aware networking applications requiring deep packet inspection and manipulation. Details... more »
Raza Microelectronics, Inc. (RMI) released the MC4100 series of advanced mezzanine cards (AMC) suited for Gigabit line-rate, content-aware networking applications requiring deep packet inspection and manipulation. Details... more »